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IME Introduces EPRC-10 To Address 3-D Integrated Circuits

July 1st, 2009 · No Comments

The Institute of Microelectronics (IME), a research institute of the Agency for Science, Technology and Research (A*STAR) in Singapore, has disclosed on 30 June 2009 the introduction of the 10th Electronic Packaging Research Consortium (EPRC-10) to address vital integration problems of 3-dimensional (3-D) Packaging and Embedded Module technologies.

Read more on IME Introduces EPRC-10 To Address 3-D Integrated Circuits.


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